发明名称 SMT TYPE CAMERA MODULE FOR IMPROVING CONNECTION WITH PCB
摘要 An SMT(Surface Mount Technology) type camera module of a structure capable of improving combining force with a PCB(Printed Circuit Board) is provided to improve the combining force when the SMT type camera module is loaded on the PCB by combining a side of a substrate together with a bottom surface of the substrate with the PCB without increasing the entire size of the camera module. A lens holder is attached to a protrusion formed on a front of a housing. A camera module substrate(20) for loading a camera module on a PCB is formed in a lower part of the housing. A plurality of grooves(22a) having length which is shorter than the thickness of the camera module substrate are formed from a lower surface to an upper surface in external sides of the camera module substrate. A plating layer(23) is formed on an inner wall of the grooves. The lower surface of the camera module substrate and the grooves are combined on the PCB by bonding and soldering.
申请公布号 KR20080044927(A) 申请公布日期 2008.05.22
申请号 KR20060113581 申请日期 2006.11.17
申请人 K9 FLIP CHIP TECHNOLOGY 发明人 KOO, JA UK;MOON, SUNG JOON;BAEK, SEON YEON
分类号 H04N5/225 主分类号 H04N5/225
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