| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition having a high dissolution inhibiting effect in a non-exposed part thereof, high sensitivity, excellent developability and excellent coating properties to a support, a positive photosensitive lithographic printing plate suitable for direct plate making using a semiconductor laser, a YAG laser or the like, and to provide a plate making method using the positive photosensitive lithographic printing plate. <P>SOLUTION: The positive photosensitive resin composition comprises a light absorbing dye, an alkali-soluble resin and a dissolution inhibitor, wherein the dissolution inhibitor is a modified polyvinyl acetal modified with a carboxylic acid and/or sulfonic acid. <P>COPYRIGHT: (C)2008,JPO&INPIT |
