发明名称 BOIL COOLING DEVICE, AND MANUFACTURING METHOD FOR THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To realize a boil cooling device and a manufacturing method of the device capable of reducing manufacturing cost. <P>SOLUTION: The boil cooling device is provided with a refrigerant tank body 10 installed with a wick 15 in an interior, storing a liquid phase refrigerant, and attached with a heating element 30 on an outer surface, and a heat dissipation part 20 cooling the refrigerant boiled by heat of the heating element 30 to carry out condensation and then returning it to the refrigerant tank body 10. The wick 15 is arranged on an inner face of a base plate 12 of the refrigerant tank body 10 with the heating element 30 fixed to the outer surface, and it is comprised of a metal porous body formed by metal plating on a porous resin member. By this, the manufacturing costs can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008116180(A) 申请公布日期 2008.05.22
申请号 JP20060301960 申请日期 2006.11.07
申请人 DENSO CORP 发明人 TANAKA KOJI
分类号 F28D15/02;F25D9/00;H01L23/427 主分类号 F28D15/02
代理机构 代理人
主权项
地址