| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and device for pasting a sheet capable of pasting to an object by allowing a pasting sheet to be expressed, without requiring a special device for peeling which physically contacts to a protective sheet that protects the pasting sheet. <P>SOLUTION: The sheet pasting device comprises a delivery means 12 which delivers a band-like original roll 11, a notch forming means 14 which forms a pasting sheet S1 by forming a notch 13 on an adhesive sheet S and a protective sheet PS constituting the original roll 11, a winding means 15 for winding an unnecessary sheet portion US on the outside of the notch 13, a peeling means 16 for peeling the protective sheet PS on the pasting sheet S1, and a pasting means 17 for pasting the pasting sheet S1 to a semiconductor wafer W. Only by changing delivery direction of the original roll 11 through the peeling means 16, the protective sheet PS is peeled from the pasting sheet S1 so that the pasting sheet S1 is pasted to the semiconductor wafer W. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
