| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an area array terminal type semiconductor package that can be easily repaired and be easily made thinner after mounting and can offer highly reliable circuit operation by improved solder bonding quality. <P>SOLUTION: Solder bonding structure is provided with a semiconductor part mounting sheet member 11 interposed, wherein a stress absorption part (spring part) 126 is interposed between an inner bonding pad 121 and the pad body 124 of a substrate bonding pad 123 at a bonding portion 12, and the pads can be mutually changed in position. Thanks to such a structure, stress applied to each of solder bonding portions is absorbed by the stress absorption part 126 in the solder bonding parts of the inner bonding pad 121 and the substrate bonding pad 123. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
