METHOD OF PACKAGING A DEVICE HAVING A MULTI-CONTACT ELASTOMER CONNECTOR CONTACT AREA AND DEVICE THEREOF

摘要

Forming a packaged device (10) having a semiconductor device (14) having a first major surface and a second major surface includes forming an encapsulating layer (18) over the second major surface of the semiconductor device (14) and around sides of the semiconductor device (14) and leaving the first major surface of the first semiconductor device exposed. A first insulating layer (46) is formed over the first major surface. A plurality of vias (48-56) are formed in the first insulating layer (46). A plurality of contacts (58-66) are formed to the semiconductor device (14) through the first plurality of vias (48-56), wherein each of the plurality of contacts (58-66) has a surface above the first insulating layer (46). A supporting layer (72) is formed over the first insulating layer (46) leaving an opening (70) over the first plurality of contacts (58-66) wherein the opening (70) has a sidewall surrounding the plurality of contacts (58-66).