SEMICONDUCTOR POWER MODULE, AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To prevent re-fusion of solder used to weld a heat sink to which a semiconductor element is coupled and a base provided under the heat sink in the method for manufacturing a semiconductor power module in the structure for storing the semiconductor element within a package.

SOLUTION: The method for manufacturing a semiconductor power module includes the steps of bonding the semiconductor element 10 with a first solder 13 having a first melting point on the heat sink 11 where a first metal layer 12d is exposed to the lower surface, providing a second solder 14 having a second melting point lower than the first melting point and also having a higher melting point on a base 4 where a second metal layer 2c is formed on the upper surface by allowing at least one metal material of the first metal layer 12d and the second metal layer 2c to melt into the second solder, providing the heat sink 11 on the second solder 14 by providing the fists metal layer 12d to the lower part thereof, and fixing the heat sink 11 on the base 4 by cooling after the second solder 14 is melted.

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