| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a coating method for filling a step between patterns such as a semiconductor wafer which has wiring patterns to level the step. <P>SOLUTION: A plurality of wiring patterns 1 lie on the substrate W, and gaps therebetween form steps. The substrate W with the steps is treated with a coating liquid with high concentration of a nonvolatile content to obtain a coating 2 having a rough thickness (a). Next, recesses remaining on the steps are filled with a coating liquid with low concentration of a nonvolatile content. In this case, the coating liquid with low concentration is not pooled at crown parts 1a, but flown to the lower step parts to form a coating 3 (b). <P>COPYRIGHT: (C)2008,JPO&INPIT |
