发明名称 SOLID-STATE IMAGE SENSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a solid-state image sensing device that can realize reduction in size. SOLUTION: A line sensor is provided with a plurality of unit pixels that are arranged linearly on a substrate on which at least two layers of metal wiring layers are laminated for photoelectric conversion of an incident light. A plurality of functional elements are formed using metal wiring layers other than the uppermost layer. On the plurality of functional elements, a wiring, provided along an arrangement direction of the plurality of unit pixels to supply at least one of electrical power and signal with electrical connection to the plurality of functional elements, is formed with the metal wiring layer of the uppermost layer. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008117832(A) 申请公布日期 2008.05.22
申请号 JP20060297461 申请日期 2006.11.01
申请人 SEIKO EPSON CORP 发明人 TANIDO HIDENORI
分类号 H01L27/146;H04N1/028 主分类号 H01L27/146
代理机构 代理人
主权项
地址