发明名称 Integrated circuit device and electronic instrument
摘要 An integrated circuit device includes data pads, I/O circuits, each of the I/O circuits respectively receiving a CMOS level data signal from one of the data pads, a high-speed I/F circuit block that includes a physical layer circuit and transfers data through a serial bus using differential signals, and a logic circuit block that receives signals from the high-speed I/F circuit block and the I/O circuits. At least some of the data pads are set to be shared pads, and first and second signals forming the differential signals are input to a receiver circuit of the physical layer circuit through the shared pads.
申请公布号 US2008116933(A1) 申请公布日期 2008.05.22
申请号 US20070984078 申请日期 2007.11.13
申请人 SEIKO EPSON CORPORATION 发明人 ISHIYAMA HISANOBU
分类号 H03K19/0175 主分类号 H03K19/0175
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