CONNECTION NORMALIZATION METHOD OF DEFECT DENSITY AND YIELD BY WAFER PARTICLE TESTING METHOD

摘要

A method for normalizing an association between defect density and yield using a wafer particle inspection method is provided to facilitate detection of particles that are a main factor of yield by grouping residual particles and by calculating the frequency for normalization. A method for normalizing an association between defect density and yield using a wafer particle inspection method comprises the steps of: determining an inspection region on an upper surface of a wafer where a plurality of semiconductor chips are located(S200); detecting particles existing on upper surfaces of the semiconductor chips located within the determined inspection region and classifying the particles(S300,S310); grouping the classified particles and individually evaluating levels of each group(S500,S600).