发明名称 PLANAR BASE MATERIAL CUTTING DEVICE AND MANUFACTURING METHOD OF PLATE
摘要 PROBLEM TO BE SOLVED: To provide plate cutting device and plate manufacturing method for cutting a base material into a required dimension without causing lowering of quality such as burrs, whitening and deformation of a cutting surface. SOLUTION: This cutting device cuts a planar base material into plate of a prescribed size. The cutting device is provided with at least a rotary blade travelable in a cutting direction and a supporting base arranged with a prescribed space from a cutting edge of the rotary blade. A cutting edge side opposed surface of the supporting base is made a curved surface swollen toward the cutting edge side. In this manufacturing method, the planar base material is introduced into a gap of the rotary blade and the supporting base arranged oppositely to the rotary blade, and the base material is cut by the rotary blade. In the method, the base material is cut by traveling the rotary blade, while holding the base material in a warped state along the cutting edge side opposed surface on the supporting base having the cutting edge side opposed surface formed into a curved shape swollen to the cutting edge side. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008114347(A) 申请公布日期 2008.05.22
申请号 JP20060301375 申请日期 2006.11.07
申请人 UBE NITTO KASEI CO LTD 发明人 YAMADA KOICHI;TOKO SOUSHI;TERUYA YOSHIHIRO
分类号 B26D7/20;B26D1/20;B26D7/14 主分类号 B26D7/20
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