| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the strength of an IC card, to reduce a manufacturing cost and to improve reliability. <P>SOLUTION: The IC card 1 is manufactured by mounting an IC card body 4 in a case 2 formed of a thermoplastic resin and by sealing and integrating it with a sealing part 3 formed of a thermoplastic resin. The IC body 4 includes: a wiring board 5 having external connection terminals 6 formed on the back surface; a semiconductor chip 7 mounted on a surface of the wiring board 5 and electrically connected to the external connection terminals 6 through bonding wires 9 and wires 10; and a sealing part 8 formed of a thermosetting resin and formed so as to cover the semiconductor chip 7 and the bonding wires 9. The sealing part 3 is so formed as to expose the external connection terminals 6. <P>COPYRIGHT: (C)2008,JPO&INPIT |
