| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacturing device of an IC chip mounting object for preventing adhesive from being attached to the suction hole of a synchronous roller. <P>SOLUTION: This manufacturing device of an IC chip mounting body is provided with: a conveyance part for conveying a film substrate on which an antenna circuit is formed at equal speeds with fixed intervals on one face; an adhesive printing part for applying adhesive on the film substrate; a synchronous roller part for moving and loading the IC chip along the film substrate with fixed intervals on the film substrate to be conveyed with equal speeds; and an IC chip supplying part for supplying the IC chip to the synchronous roller part. This manufacturing device is provided with: an IC chip loading part for loading the IC chip on a site to which adhesive on the film substrate is applied; and a judgement part for judging whether or not the synchronous roller part is provided with the IC chip. When the synchronous roller part is judged not to be provided with the IC chip by the judgement part, it is desired that any adhesive is not applied to such a site on which the IC chip is to be loaded on the film substrate by the adhesive print part. <P>COPYRIGHT: (C)2008,JPO&INPIT |
