| 摘要 |
In one embodiment, a printed circuit board includes a plurality of insulating layers in which an aperture is formed through some of the layers. A resistive plug at least partially fills the aperture and contacts respective conductive members at each end of the resistive plug to form a resistive via that traverses partially through the printed circuit board. In another embodiment, a printed circuit board includes a plurality of insulating layers in which an aperture is formed through at least some of the layers. A dielectric plug at least partially fills the aperture and contacts respective conductive members at each end of the dielectric plug to form a capacitive via that traverses at least partially through the printed circuit board.
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