| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To form a film which does not react with various types of reactive gases, and can block the outward diffusion of metal on the surface of a metallic component. <P>SOLUTION: This substrate treatment apparatus is equipped with a metallic component with at least a part of its metallic surface exposed to the inside of a treatment chamber 201, and at least a part of its metallic surface of the metallic component exposed to the inside of the treatment chamber 201 is subjected to baking treatment at pressure lower than atmospheric pressure. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
