| 摘要 |
PROBLEM TO BE SOLVED: To prevent a plurality of substrates from getting damaged successively due to foreign matters or the like on a backup tool when fully pressure-bonding a temporarily pressure-bonded electronic component onto a substrate. SOLUTION: A device for pressure-bonding an electronic component includes the backup tool 20 for supporting a substrate 60, a pressurizing part 30 for pressing the temporarily pressure-bonded electronic component 65 via a tape on the substrate 60 for fully pressure-bonding the component 65 onto the substrate 60, a driving part 10 for driving the pressurizing part 30 toward the backup tool 20, a load measuring part 40 for measuring a load applied from the component 65 to the part 30, and a control mechanism 50 coupled with the measuring part 40 and the driving part 10. The control mechanism 50 controls the driving part 10 based on a load curve LD consisting of a load value applied to the pressurizing part 30 with respect to time obtained from the load value applied to the part 30 measured by the part 40 so that the load curve LD shows a desired shape. The mechanism 50 detects damage of the substrate 60 based on the curve LD. COPYRIGHT: (C)2008,JPO&INPIT
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