发明名称 |
TRANSFER SUBSTRATE AND TRANSFER METHOD USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a transfer substrate and a transfer method using the same having excellent releasability between the transfer substrate and a transfer pattern and capable of remarkably improving a transfer rate between the transfer substrate and a target substrate. <P>SOLUTION: The transfer pattern 12 having thermal expansion rate different from the substrate 11 is formed on the substrate 11. Afterward, micro peeling is partially made between the substrate 11 and the transfer pattern 12 by heating or cooling in accordance with the difference of the thermal expansion rate between the substrate 11 and the transfer pattern 12. An adhesive force between the substrate 11 and the transfer pattern 12 can be reduced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008114448(A) |
申请公布日期 |
2008.05.22 |
申请号 |
JP20060298952 |
申请日期 |
2006.11.02 |
申请人 |
FUJI XEROX CO LTD |
发明人 |
SUZUKI SADAICHI;TABATA KAZUAKI;YAMAZAKI YOSHIFUMI;NAGAO TASUKE;YAMADA TAKAYUKI |
分类号 |
B32B7/06;B32B15/088;G03F7/20;H01L21/027 |
主分类号 |
B32B7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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