| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of enhancing connection reliability of a solder pad. <P>SOLUTION: An opening 71 of a solder resist layer 70 is formed such that the opening 71 overlaps a peripheral portion of a solder pad 75 by 5μm and overlapping thickness thereof is 20μm; and therefore, the solder pad 75 does not come off from an interlayer insulating layer 150 and the connection reliability is improved. Furthermore, since the solder pad 75 is closely adhered to the solder resist layer 70, the underlying interlayer insulating layer 150 hardly cracks. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
