| 摘要 |
PROBLEM TO BE SOLVED: To provide a soldering method in a soldering device capable of attaining the excellent deposition state of a solder and enhancing the quality by promoting the wettability of the solder. SOLUTION: A core portion 2a of an end of a wire 2 with a covered portion 2b thereof being peeled is inserted in a soldering tank 3 by the predetermined length, and a solder 4 is deposited on the core portion 2a. The soldering method comprises a basic insertion-evacuation step of one reciprocation of inserting/evacuating the core portion 2a in/from the solder tank 3 by the predetermined length, and a solder deposition promoting step of moving the core portion 2a to be inserted in the solder tank 3 by the basic insertion-evacuation step in the molten solder 4 in addition to one reciprocation. The solder 4 is deposited on the core portion 2a by combining the basic insertion-evacuation step and the soldering deposition promoting step. COPYRIGHT: (C)2008,JPO&INPIT
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