| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of applying a heat resistant resin composition containing a heat resistant resin and a solvent having≤200°C boiling point to form a coating film having uniform film thickness. SOLUTION: The method of applying the heat resistant resin composition containing the heat resistant resin and the solvent having≤200°C boiling point is carried out by dropping and rotatively applying the heat resistant resin composition on a position 10-30 mm away from the center of a substrate rotating at 1,000-3,000 rpm. The method of applying the heat resistant resin composition containing the heat resistant resin and the solvent having≤200°C boiling point is carried out by dropping and rotatively applying the heat resistant resin composition on a position 10-30 mm away from the end part of a substrate rotating at 1,000-3,000 rpm. COPYRIGHT: (C)2008,JPO&INPIT
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