| 摘要 |
A semiconductor device has the package structure which used the lead frame, a communication device (semiconductor chip) is arranged to the main surface side of a supporting body, and the condenser for firing is arranged to the back side of the opposite side to the main surface of said supporting body. By having such structure, a miniaturization, the reduction of a manufacturing cost, and high reliability of a semiconductor device and an ignition device can be aimed at.
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