| 摘要 |
The invention relates to a printed circuit or substrate plate (10) which is intended to receive electronic components and is provided with printed conductor tracks (12). According to the invention, one or more conductor bars (18) are mounted one after the other between the connecting conductor surfaces (140, 142, 144), said conductor bars (18) being electrically interconnected during a subsequent wave soldering process or in a remelt furnace. |
