发明名称 |
METHODS OF ETCHING A PATTERN LAYER TO FORM STAGGERED HEIGHTS THEREIN AND INTERMEDIATE SEMICONDUCTOR DEVICE STRUCTURES |
摘要 |
<p>A method of forming staggered heights in a pattern layer of an intermediate semiconductor device structure. The method comprises providing an intermediate semiconductor device structure comprising a pattern layer and a first mask layer. forming first openings in the pattern layer, forming spacers adjacent to etched portions of the pattern layer to reduce a width of the first openings, etching the pattern layer to increase a depth of the first openings, and forming second openings in the pattern layer, A method of forming staggered heights in the pattern layer that includes spacers formed on multiple mask layers is also disclosed. Intermediate semiconductor device structures are also disclosed.</p> |
申请公布号 |
WO2008061031(A1) |
申请公布日期 |
2008.05.22 |
申请号 |
WO2007US84323 |
申请日期 |
2007.11.09 |
申请人 |
MICRON TECHNOLOGY, INC.;WELLS, DAVID, H. |
发明人 |
WELLS, DAVID, H. |
分类号 |
H01L21/308;H01L21/033;H01L21/8242 |
主分类号 |
H01L21/308 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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