发明名称 METHODS OF ETCHING A PATTERN LAYER TO FORM STAGGERED HEIGHTS THEREIN AND INTERMEDIATE SEMICONDUCTOR DEVICE STRUCTURES
摘要 <p>A method of forming staggered heights in a pattern layer of an intermediate semiconductor device structure. The method comprises providing an intermediate semiconductor device structure comprising a pattern layer and a first mask layer. forming first openings in the pattern layer, forming spacers adjacent to etched portions of the pattern layer to reduce a width of the first openings, etching the pattern layer to increase a depth of the first openings, and forming second openings in the pattern layer, A method of forming staggered heights in the pattern layer that includes spacers formed on multiple mask layers is also disclosed. Intermediate semiconductor device structures are also disclosed.</p>
申请公布号 WO2008061031(A1) 申请公布日期 2008.05.22
申请号 WO2007US84323 申请日期 2007.11.09
申请人 MICRON TECHNOLOGY, INC.;WELLS, DAVID, H. 发明人 WELLS, DAVID, H.
分类号 H01L21/308;H01L21/033;H01L21/8242 主分类号 H01L21/308
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