| 摘要 |
PROBLEM TO BE SOLVED: To solve a matter that soldering strength becomes weak at the time of mounting a substrate because a metal surface is exposed to the cutting surface when the part of each lead terminal located on the outside of a molding is cut by means of a cutting punch and a receiving die in production of a packaged solid-state electrolytic capacitor. SOLUTION: A vertical through hole 13 is formed in each lead terminal 3 for a capacitor element 2. Following a step for packaging the capacitor element 2 by a molding 5 such that the through hole 13 of each lead terminal 3 is located on the outside of the synthetic resin molding 5, each lead terminal 3 undergoes metal plating. Subsequently, each lead terminal 3 is cut at the parts of a pair of narrow bridge portions 23 and 23 located on the opposite sides of the through hole 13 using a receiving die 16 and a cutting punch 17. An inward recess 19 corresponding to the inner wall face of the through hole 13 on the molding 5 side is formed in the cutting punch 17. COPYRIGHT: (C)2008,JPO&INPIT |
