| 摘要 |
A BGA package with encapsulation on substrate bottom comprises a chip, a substrate, a molding compound and a plurality of solder balls. The substrate has a SMT surface placing a plurality of ball pads. The molding compound encapsulates a solder resist layer on the SMT surface of the substrate and has a plurality of through holes exposing the ball pads respectively. The hole diameter of the through holes is greater than that of the openings of the solder resist layer on the substrate to allow the solder balls not to contact the molding compound. The solder balls are disposed in the through holes and are bonded to the exposed ball pads of the substrate thereby enhancing moisture resistance of BGA products and preventing the solder balls from falling because of contact stress of the molding compound.
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