发明名称 |
Method For Producing A Laser Diode Component, Housing For A Laser Diode Comoponent, And Laser Diode Component Itself |
摘要 |
A method for producing a laser diode component having an electrically insulating housing basic body ( 1 ) and electrical connecting conductors ( 5 a, 5 b), which are led out from the housing basic body and are accessible from outside the housing basic body ( 1 ). The housing basic body ( 1 ) is produced from a material which is transmissive to a laser radiation to be emitted by the laser diode component, and comprises a chip mounting region ( 3 ). A beam axis ( 100 ) of the laser diode component runs through the housing basic body ( 1 ). A housing that can be produced in this way and laser diode component having a housing of this type are also disclosed.
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申请公布号 |
US2008116551(A1) |
申请公布日期 |
2008.05.22 |
申请号 |
US20040558660 |
申请日期 |
2004.05.26 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
FERSTL CHRISTIAN;GROTSCH STEFAN;ZEILER MARKUS |
分类号 |
H01L21/00;H01L23/02;H01L23/12;H01S3/00;H01S5/00;H01S5/022;H01S5/024 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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