发明名称 Method For Producing A Laser Diode Component, Housing For A Laser Diode Comoponent, And Laser Diode Component Itself
摘要 A method for producing a laser diode component having an electrically insulating housing basic body ( 1 ) and electrical connecting conductors ( 5 a, 5 b), which are led out from the housing basic body and are accessible from outside the housing basic body ( 1 ). The housing basic body ( 1 ) is produced from a material which is transmissive to a laser radiation to be emitted by the laser diode component, and comprises a chip mounting region ( 3 ). A beam axis ( 100 ) of the laser diode component runs through the housing basic body ( 1 ). A housing that can be produced in this way and laser diode component having a housing of this type are also disclosed.
申请公布号 US2008116551(A1) 申请公布日期 2008.05.22
申请号 US20040558660 申请日期 2004.05.26
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 FERSTL CHRISTIAN;GROTSCH STEFAN;ZEILER MARKUS
分类号 H01L21/00;H01L23/02;H01L23/12;H01S3/00;H01S5/00;H01S5/022;H01S5/024 主分类号 H01L21/00
代理机构 代理人
主权项
地址