摘要 |
A solvent cast film comprises a polyimide comprising structural units derived from polymerization of a dianhydride component comprising a dianhydride selected from the group consisting of 3,4'-oxydiphthalic dianhydride, 3,3'-oxydiphthalic dianhydride, 4,4'-oxydiphthalic dianhydride, and combinations thereof, with a diamine component comprising 4,4'-diaminodiphenylsulfone; wherein the polyimide has a glass transition temperature from 190°C to 400°C; and wherein the film has a coefficient of thermal expansion of less than 60 ppm/°C, a thickness from 0.1 to 250 micrometers, endless than 5% residual solvent by weight. |
申请人 |
GENERAL ELECTRIC COMPANY;CHAN, KWOK, PONG;HAGBERG, ERIK;MULLEN, TARA, J.;ODLE, ROY, RAY |
发明人 |
CHAN, KWOK, PONG;HAGBERG, ERIK;MULLEN, TARA, J.;ODLE, ROY, RAY |