| 摘要 |
<p>An unloading handler for a semiconductor package is provided to allow one handler to perform package unloading operation using two boats having different sizes by simply removing or replacing a component, thereby improving compatibility of the handler. An unloading handler for a semiconductor package comprises an unloading part(80), a boat aligning part(20), a boat transfer part(30), a plurality of unloading pickers(51,52), a boat return part(90), and a plurality of carrier bocks(40a,40b). The unloading part comprises an empty tray(T) for keeping a semiconductor package(P). The boat aligning part allows a boat carrying the semiconductor package loaded from outside to be aligned. The boat transfer part is installed on one side of the boat aligning part to receive the boat from the boat aligning part. The unloading pickers pick up the semiconductor package on the boat transferred from the boat transfer part and place it in the empty of the unloading part. The boat return part receives an empty boat where the semiconductor package is removed by the unloading picker, and puts the empty boat in a magazine(96). The carrier blocks are movably installed along a package pickup position of the boat transfer unit and unloading picker, and the boat return part, to pick up the boat from the boat transfer unit and successively transfer the boat to the package pickup position and the boat return part.</p> |
