发明名称 |
LAMINATED SUBSTRATE FOR MOUNTING ELECTRONIC PARTS |
摘要 |
The invention relates to a laminated substrate producing method for mounting semiconductor chips, wherein at least respective metal and plastic structure films having respective different recurrent contour are laminated together in such a way that a material strip is obtained and said lamination is followed by perforations or cuttings, the inventive method is characterised by at least one of the following steps: A) the films are structured in such a way that the superposition thereof makes it possible to obtain the areas which are devoid of overlap through the total thickness thereof; B) the films are not laminated through the total thickness of the laminate in partly recurrent areas; and C) the reccurent cross-sections of the reccurent contours are curved from the surface of the laminated strip starting from said laminate. |
申请公布号 |
KR20080045199(A) |
申请公布日期 |
2008.05.22 |
申请号 |
KR20087006187 |
申请日期 |
2006.09.08 |
申请人 |
W.C. HERAEUS GMBH |
发明人 |
DITZEL ECKHARD;WALTER SIEGFRIED;GRESCH MANFRED |
分类号 |
H01L23/50;H05K3/20;H05K3/40;H05K3/46 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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