| 摘要 |
<P>PROBLEM TO BE SOLVED: To reliably suck the central position of an electronic component ranging from a large component to a small component by using the automatic calibration effect of the suction position. <P>SOLUTION: A method of packaging an electronic component wherein the electronic component is mounted to a substrate after being sucked and held by a suction nozzle mounted to a mounting head. In this method, liquid W is applied to the suction end of a suction nozzle 6, and then an electronic component 7 is sucked. <P>COPYRIGHT: (C)2008,JPO&INPIT |
