| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To enhance the degree of freedom in design such as the size, number and mounting position of a semiconductor chip. <P>SOLUTION: Semiconductor chips 2-4 are buried in a resin mold portion 5 and a plurality of holes 6 are arranged in matrix in a terminal board 1 exposed to the backside of the resin mold portion 5. A portion wider than an opening on the other side is formed at least partially at an opening on the backside of the terminal board 1 in these holes 6 and mold resin intrudes up to the wide portion. A plurality of dicing grooves 8 are formed to divide a resin intrusion portion 7 in the hole 6 longitudinally in half-cut state from the backside in the direction coupling a plurality of holes 6. Since a part of the terminal board 1 is separated by these dicing grooves 8, a plurality of terminals 9 are formed and the semiconductor chips 2-4 are connected electrically with the terminals 9. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
