发明名称 LASER BEAM MACHINING APPARATUS, LASER BEAM MACHINING HEAD, AND LASER BEAM MACHINING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To reduce debris sticking to a workpiece by efficiently removing and collecting scattered substances generated by laser beam machining. <P>SOLUTION: A laser beam machining apparatus is provided with a laser beam machining head including: a transmitting window 9 for transmitting a laser beam, an opening 20 for passing the laser beam passed through the transmitting window 9, an introduction hole 41 for introducing gas to the inside of the apparatus, an exhaust port 16 for discharging an atmosphere inside the apparatus to the outside, a first air vent 18 for introducing a gas to the vicinity of the laser beam irradiation region of the workpiece 7, a second air vent 17 which is installed at a position opposite to the first air vent 18 and which discharges the atmosphere near the laser beam irradiation region of the workpiece 7, an opening 42a arranged between the transmitting window 9 and the opening 20 for passing the laser beam passed through the transmitting window 9, and a shielding plate 42a formed with a ventilation part 44 communicating with the opening 42a, the introduction hole 41 and the exhaust port 16. In this configuration, substances 21 scattered by laser machining can be trapped by the shielding plate 42. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008114252(A) 申请公布日期 2008.05.22
申请号 JP20060299526 申请日期 2006.11.02
申请人 SONY CORP 发明人 SASAKI YOSHINARI;ASO YUKINARI;MURASE EIJU;YAMADA NAOKI
分类号 B23K26/16;B23K26/00;B23K26/06;B23K26/36 主分类号 B23K26/16
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