| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an exposure device which improves an exposure accuracy by considering the influence of flare even in the circumference of a wafer. <P>SOLUTION: The exposure device of this invention is provided with an exposure amount control unit (501) for changing a part of the exposure amount at least in an exposure region in accordance with the position of the exposure region on a sensitive substrate (401) whereby at least an exposure amount of part in the exposure region is changed so that the exposure amount in the periphery of the wafer where at least a part of the neighboring exposure region does not exist becomes the same as a region except an end part whose exposure amount is affected by the flare in the neighboring exposure region. <P>COPYRIGHT: (C)2008,JPO&INPIT |
