METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE CONTAINING SEMICONDUCTOR PACKAGE MANUFACTURED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To reduce dimensions of a semiconductor package and a semiconductor device containing the semiconductor package.

SOLUTION: A method of manufacturing a semiconductor package 71 comprises: a step for forming a metal circuit pattern 702 on a substrate; a step for connecting an integrated circuit unit 703 to the metal circuit pattern 702; a step for forming resins 708 on the substrate, the metal circuit pattern 702, and the integrated circuit unit 703; and a step for removing the substrate.

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