| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component and a wire bonding method capable of suppressing a cut of the wire. <P>SOLUTION: The electronic component comprises a drive IC 4 having an electrode 41, and a connection object connected to the electrode 41 through the wire 5A. One end of the connection object side out of the wire 5A is a crown-like first bonding part, and the other end of the electrode 41 side out of the wire 5A is a constricted second bonding part 52 having a narrower cross section toward a front edge direction. The second bonding part 52 is sandwiched by a first bump 6A formed on the electrode 41 and a second bump 6B positioning at the side opposite to the first bump 6A to the second bonding part 52. <P>COPYRIGHT: (C)2008,JPO&INPIT |
