发明名称 |
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A method of manufacturing an electronic component includes the steps of a) forming a plurality of wiring boards that include first through holes penetrating through a semiconductor substrate and conductive material buried in the first through holes; b) providing conductive projections on the conductive material of any of the plurality of wiring boards; and c) bonding the plurality of wiring boards to each other and electrically connecting the conductive material of the respective wiring boards by the projections.
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申请公布号 |
US2008117607(A1) |
申请公布日期 |
2008.05.22 |
申请号 |
US20070943194 |
申请日期 |
2007.11.20 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MURAYAMA KEI;TAGUCHI YUICHI;SHIRAISHI AKINORI;SUNOHARA MASAHIRO;HIGASHI MITSUTOSHI |
分类号 |
H05K7/00;H05K3/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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