发明名称 |
Optical device module and method for fabricating the same |
摘要 |
A solid-state image sensor includes a first image sensing device, a first flexible substrate connected to the first image sensing device, a second solid-state image sensing device, and a second flexible substrate connected to the second solid-state image sensing device. The solid-state image sensing devices are disposed adjacently to each other such that light receiving surfaces are perpendicular to each other. The second solid-state image sensing device directly receives incident light. However, the first solid-state image sensing device receives the incident light reflected by a mirror. Electronic components are mounted on the two flexible substrates. The first flexible substrate is bent at two bending positions to face the second flexible substrate and electrically connected thereto.
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申请公布号 |
US2008117324(A1) |
申请公布日期 |
2008.05.22 |
申请号 |
US20070979122 |
申请日期 |
2007.10.31 |
申请人 |
MINAMIO MASANORI;HARADA YUTAKA;ISHIKAWA TAKAHITO;FUKUDA TOSHIYUKI;TAKAYAMA YOSHIKI |
发明人 |
MINAMIO MASANORI;HARADA YUTAKA;ISHIKAWA TAKAHITO;FUKUDA TOSHIYUKI;TAKAYAMA YOSHIKI |
分类号 |
H04N5/225;H04N5/335;H04N5/369 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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