MOUNTING DEVICE, PLASMA PROCESSING DEVICE, AND PLASMA PROCESSING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting device in which there is no fear of causing any contamination of a heavy metal to a processed body and an electrostatic chuck doesn't cause any dielectric breakdown for a long period of time.

SOLUTION: The mounting device consists of a yttrium oxide frame spraying layer with a thickness of 200 to 280 μm in which an electrostatic chuck layer which is an insulating layer at a front surface side of an electrode layer is formed by a plasma frame spray, and has such a configuration that a front surface of the mounting device is formed to a surface roughness depending on a particle size of yttrium oxide by which a frame spraying is carried out. By making such a configuration, a durability to a plasma increases, and moreover there is no fear of causing any contamination of the heavy metal.

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