| 摘要 |
PROBLEM TO BE SOLVED: To provide a glass ceramic circuit board which can establish high dimensional accuracy by confining burning and improve adhesive strength of a surface conductor layer, and to provide its manufacturing method. SOLUTION: Both front and rear surfaces are bonded to a glass ceramic insulation layer and are confined thereby. One-side confining layers 1a and 1g with a surface conductor layer 2 provided on its surface are formed so that their porosity may be larger than that of both-side confining layers 1b, 1c and 1d of which both surfaces vertical in the lamination direction are bonded and confined to/by the glass ceramic insulation layer. The porosity of the one-side confining layer is preferably more than 5.0 vol.% and less than 28.4 vol.%, and the porosity of the both-side confining layer is preferably more than 0.5 vol.% and less than 5.0 vol.%. COPYRIGHT: (C)2008,JPO&INPIT |
