| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip module which is capable of mounting semiconductor chips efficiently on it, high in performance, and small in size. SOLUTION: The multi-chip module is equipped with an interposer, which is equipped with a first surface and a second surface that is located opposite to the first surface and provided with a depression of prescribed depth, a first semiconductor chip mounted on the first surface of the interposer, a second semiconductor chip that is mounted in the depression provided to the second surface of the interposer and thinner than the depth of the depression, a first resin member sealing up the first semiconductor chip on the first surface of the interposer, a second resin member sealing up the second semiconductor chip in the depression provided to the second surface of the interposer, and two or more solder balls that are arranged on the area of the second surface of the interposer other than the depression and electrically connected to the first semiconductor chip or second semiconductor chip. COPYRIGHT: (C)2008,JPO&INPIT |
