| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for processing a substrate by which cooling speed of the substrate is increased and further, even when the substrate is deformed, the substrate can be cooled uniformly. SOLUTION: Mist is supplied to the surface of the substrate 9. By vaporizing drops of purified water adhering to the surface of the substrate 9, the substrate 9 is cooled. Consequently the entire substrate 9 can be cooled uniformly even when the substrate 9 is deformed. Further, since vaporization heat is directly absorbed from the substrate 9 to cool the substrate 9, the substrate 9 can be rapidly cooled. COPYRIGHT: (C)2008,JPO&INPIT
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