POLYAMIDE-IMIDE, METHOD FOR PRODUCING POLYAMIDE-IMIDE, AND RESIN COMPOSITION AND RESIN VARNISH CONTAINING POLYAMIDE-IMIDE

摘要

PROBLEM TO BE SOLVED: To provide a polyamide-imide effective for relaxing the thermal stress in the mounting of a semiconductor chip, having excellent heat-resistance and desmear resistance and enabling low-temperature curing in the case of using by mixing with an epoxy resin. SOLUTION: The polyamide-imide has 2-20 phenolic hydroxyl groups in the molecule and a≥18C long-chain hydrocarbon chain structure in the main chain. COPYRIGHT: (C)2008,JPO&INPIT