| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is free from the occurrence of peeling or cracking after a reflow process in a packaging process and to provide an electronic component device provided with an elemental component sealed by the epoxy resin composition. SOLUTION: The epoxy resin composition for sealing a plated lead frame package contains (A) an epoxy resin and (B) a curing agent wherein (B) the cuing agent contains a curing agent represented by general formula (I) and a curing agent represented by general formula (II). In the formula (I), n represents an integer of 0-10 and in the formula (II), n represents an integer of 0-14. COPYRIGHT: (C)2008,JPO&INPIT
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