| 发明名称 |
APPARATUS FOR POLISHING DIE AND METHOD OF POLISHING DIE |
| 摘要 |
<p>An apparatus for polishing a die (1) having a constitution wherein a means (63) of obtaining data concerning a die (D) from an IC chip (81) formed in the die (D) is provided and the die (D) is polished under appropriate conditions that are determined based on the data obtained by the means (63) of obtaining the die data.</p> |
| 申请公布号 |
WO2008059585(A1) |
申请公布日期 |
2008.05.22 |
| 申请号 |
WO2006JP322966 |
申请日期 |
2006.11.17 |
| 申请人 |
AMADA COMPANY, LIMITED;KOMIYA, HIDENORI |
发明人 |
KOMIYA, HIDENORI |
| 分类号 |
B24B17/10 |
主分类号 |
B24B17/10 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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