| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a pickup device capable of picking up a semiconductor chip from an adhesive sheet reliably and easily. <P>SOLUTION: The pickup device has: a backup body, where an upper surface is formed on a suction surface for sucking and holding a portion corresponding to the periphery of the semiconductor chip 3 to be picked up on the lower surface of the adhesive sheet 2; a push-up body 27 that is vertically movably provided in the backup body the push-up body 27 pressing the lower surface of a portion in which the semiconductor chip to be picked up on the adhesive sheet is bonded for pushing up the semiconductor chip from the upper surface of the backup body; and an upper suction nozzle 8 for sucking and holding the upper surface of the semiconductor chip to be picked up to pick up the semiconductor chip pushed up by the push-up body from the adhesive sheet. The push-up body is formed by a flexible elastic material, where the periphery is elastically deformed downward by tension occurring on the adhesive sheet when the semiconductor chip is pushed up through the adhesive sheet. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
