发明名称 |
SUBSTRATE HEATING DEVICE AND SUBSTRATE HEATING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate heating device and a substrate heating method for achieving rapid heating and stable temperature control by a simple configuration. SOLUTION: The substrate heating device is disposed in an opening 3a of a carrier 3 for heating a substrate 4. The substrate 4 has a plurality of downwardly projected pin terminals 4c on the lower surface thereof. A protruded member 14 projected directed to the lower plane of the substrate 4 is provided on the heating unit 11. Gas heated by a heating unit 11 is intermittently blown to the lower surface of the substrate 4 from the upper surface of the protruded member 14 using an on/off-valve. The substrate 4 is heated by radiation to a heat receiving plane 4d surrounded by the pin terminals 4c from the heating plane of the upper surface of the projected member 14. The temperature of the substrate 4 is maintained at a target temperature by being rapidly heated at the starting of the heating by continuously blowing the heated gas to the substrate 4 in the open state of the on/off-valve and by intermittently blowing the gas by repeatedly actuating the on/off-valve. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008118159(A) |
申请公布日期 |
2008.05.22 |
申请号 |
JP20080014628 |
申请日期 |
2008.01.25 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NAKATSUJI HACHIRO;IIZUKA AKIRA;OKAMOTO KENJI;ICHIKAWA ITSUKI;KABESHITA AKIRA |
分类号 |
H01L21/56;H05K3/34 |
主分类号 |
H01L21/56 |
代理机构 |
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