发明名称 SUBSTRATE HEATING DEVICE AND SUBSTRATE HEATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a substrate heating device and a substrate heating method for achieving rapid heating and stable temperature control by a simple configuration. SOLUTION: The substrate heating device is disposed in an opening 3a of a carrier 3 for heating a substrate 4. The substrate 4 has a plurality of downwardly projected pin terminals 4c on the lower surface thereof. A protruded member 14 projected directed to the lower plane of the substrate 4 is provided on the heating unit 11. Gas heated by a heating unit 11 is intermittently blown to the lower surface of the substrate 4 from the upper surface of the protruded member 14 using an on/off-valve. The substrate 4 is heated by radiation to a heat receiving plane 4d surrounded by the pin terminals 4c from the heating plane of the upper surface of the projected member 14. The temperature of the substrate 4 is maintained at a target temperature by being rapidly heated at the starting of the heating by continuously blowing the heated gas to the substrate 4 in the open state of the on/off-valve and by intermittently blowing the gas by repeatedly actuating the on/off-valve. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008118159(A) 申请公布日期 2008.05.22
申请号 JP20080014628 申请日期 2008.01.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NAKATSUJI HACHIRO;IIZUKA AKIRA;OKAMOTO KENJI;ICHIKAWA ITSUKI;KABESHITA AKIRA
分类号 H01L21/56;H05K3/34 主分类号 H01L21/56
代理机构 代理人
主权项
地址