| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an arrangement of multi-function thin film electric resistance-capacitors by easily manufacturing by utilizing a patterning process of semiconductor manufacturing, constituting and adjusting the thickness of a dielectric layer or a larger thickness of a pattern to easily constitute and produce electric resistance, a capacitor containing a plurality of different electric resistance values and capacitance values, or the combination of them on a single chip, reducing material and production costs, including a lot of passive components at the same time in one substrate, reducing the number of times of Die bond, and saving a sealing work time. <P>SOLUTION: The arrangement multi-function thin film electric resistance-capacitors is used for an optical fiber communicating optical receiver module. By patterning by photo-lithography, a dielectric thin film and a metal layer pattern are formed on the surface of a Silicon Substrate. By the thin film thickness and the pattern, the electric resistance, the capacitor having a plurality of different resistance values or capacitance values, or the combination of them, and circuit connection wiring between them are formed on the single chip. To directly die-bond a Photodiode of the optical fiber communicating optical receiver module to the electric resistance-capacitor arrangement, the chip thickness is adjusted in a polishing process used for the semiconductor manufacturing to adjust a required optical height position. <P>COPYRIGHT: (C)2008,JPO&INPIT |
