| 摘要 |
An LED and liquid-vapor heat-dissipating device assembly is composed of a liquid-vapor heat-dissipating device and at least one LED unit. The liquid-vapor heat-dissipating device includes a metal housing, a predetermined amount of liquid, and a capillary member. The LED unit includes an LED chip mounted to and electrically connected with the metal housing, an insulating board mounted to the surface of the metal housing, an electrode located on the insulating board, a wire having two ends connected with the LED chip and the electrode respectively, and a sealant fully encapsulating the wire and the LED chip and at least partially encapsulating the insulating board and the electrode. Accordingly, the heat generated by the LED chip can be directly conducted to the liquid-vapor heat-dissipating device and, such that the present invention has preferably thermally conductive/dissipating efficiency.
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