| 摘要 |
<p>A semiconductor device, a stacked semiconductor device and an interposer substrate are provided to reduce the stress between semiconductor substrate and a PCB or stacked semiconductor devices by providing a folding part at the solder ball mounting part of an insulating substrate. A semiconductor device(20) comprises a semiconductor element(4), an interposer substrate(3), a connection layer(5) and an external terminal(8) of a solder ball. The interposer substrate comprises a wiring pattern connected with the semiconductor element electrically, and comprises an insulating substrate(1) which is formed by including the wiring pattern. The connection layer attaches the semiconductor element to the interposer substrate. The external terminal of the solder ball is arranged on the interposer substrate. The insulating substrate is folded at a portion where the external terminal is mounted, and the folding portion(1a) and an unfolding portion are positioned opposite each other, so as to form a gap(22) between them.</p> |
